WZ-WWFG12M-01
Transmission band is 920.9~924.9MHz, GFSK modulation, and 11 channels.
Depends on ICs functional ability, we can customize transmission band and number of channels by customers' requirements.
| Protocol: Wi-SUN |
| IC Core: ARM Cortex-M4 |
| RAM: 256kB |
| Flash: 1MB |
| Voltage: 1.8 - 3.8V |
| Working Temperature: -40 °C to 85 °C |
| Radio Frequency: 920MHz |
| Data Rate: 2Mbps |
| Tx Power: 19dBm(Max) |
| Rx Sensitivity: -126.2dBm @ 600kbps GFSK 920MHz |
| Tx Energy: 35.3mA @ 14dBm |
| Rx Energy: 10.8mA |
| Module Size: 20.0mm x 15.5mm |
This module contains an EFR32FG12 wireless SoC, customer should buy a SLWSTK6007A (Wi-SUN wireless starter kit) to do programming and debugging. Or, customers could outsourcing the design job to us.
There is a 10-pin connector, it has functions:
• Serial Wire Debug (SWD) with SWO
• Packet Trace Interface (PTI)
• Virtual COM port (VCOM)
• AEM monitored voltage rail
Phase 1: Requirements Analysis and Solution Design
The goal of this phase is to transform the client's vague concepts into actionable engineering specifications.
Key Tasks
1. In-depth Requirements Interviews: Clarify product functions, target cost, application scenarios, safety certifications, projected production volume, and lifecycle.
2. System Solution Design: Draw system block diagrams, define power architecture, main control chip, and communication interfaces, etc.
3. Project Timeline and Quotation: Provide a complete quotation including design fees, mold fees, prototyping fees, and mass production unit price, and jointly establish development milestones with the client.
Phase 2: Hardware Design
Key Tasks
1. Schematic Design: Draw a complete circuit diagram based on the specifications and perform signal integrity and power integrity simulations.
2. PCB Layout Design: Collaborate with structural engineers to define the board outline, hole positions, and height restrictions, and plan the placement of critical components.
3. Customer Confirmation and Archiving: Provide the final layout and wiring diagram and 3D simulation diagram to the customer for approval, and output production documents upon completion.
Phase 3: Rapid Prototyping and Functional Verification
Through rapid prototyping, produce the first prototype in the shortest possible time for functional testing.
Key Tasks
1. PCB Fabrication: Send Gerber Files to our own or partner PCB manufacturers for production.
2. PCBA Assembly: Perform SMT surface mount technology and necessary DIP insertion, including burning initial test firmware.
3. Customer Sample Delivery and Iteration: Provide test reports and samples, and modify the design based on customer feedback until the sample fully meets functional requirements.
Phase 4: Pilot Production Validation
Before mass production, small-batch pilot production is used to validate product maturity and process stability.
Key Tasks
1. Small-Batch Pilot Production: Typically involves producing 50-200 units, fully simulating the mass production line, fixtures, and testing processes.
2. Design Freeze: All pilot production issues are compiled for final revisions. After this, the design is generally frozen, and the project transitions to the mass production phase.
Phase 5: Mass Production and Shipment
Key Tasks
1. Mass Production: Integrate fully automated production lines to make PCBA.
2. Outgoing: Deliver the goods to the designated location according to the customer's requirements.
Phase 6: After-Sales Service and Continuous Optimization
Delivery is not the end, but the beginning of a long-term partnership.
Our Services:
We provide product warranties, technical support, repair analysis (RMA), and regularly review customers feedback with our clients.
Client Value:
Clients can focus on brand management and marketing, while we provide strong support for subsequent production, material preparation, maintenance, and even product updates.